Development of 3D electro-optical integration based on silicon photonic TSV interposer
Silicon photonics has been intensively researched and investigated as it provides a low-cost and power efficient solution for next generation interconnect technology based on on-chip, chip-to-chip, and long-haul optical communication. A multifunctional platform requires photonic integrated circuits...
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| Format: | Thesis |
| Language: | English |
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2016
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| Online Access: | https://hdl.handle.net/10356/67281 |