Hermetic Packaging of Sensor
Two types of bonding were investigated in this study, which consist of Cu-Cu fusion bonding use of Ar/N plasma activation and Au-Al Thermocompression bonding. Both bonding are direct metal to metal bonding. Cu-Cu fusion bonding use of Ar/N plasma activation is a derivative, directed to lower proces...
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| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2016
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| Online Access: | http://hdl.handle.net/10356/67766 |