Report on industrial attachment with Hewlett-Packard (Singapore) Pte Ltd
This report focuses on, but not limited to, crack die e-test failure behavior of TIJ 2.X generation of HP print heads. The main interest of this project is to characterize the failures, especially, but not limited to, crack die. Means of electrical test and visual inspections are used extensively to...
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2008
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| Online Access: | http://hdl.handle.net/10356/6798 |