Development of high performance heat sink for power electronics
Thermal management in the field of electronic devices has become a challenge due to the recent miniaturization trend, which results in an inevitable increase in power density requirement. Moreover conventional cooling technologies may not maintain a low junction temperature required for the chip. In...
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| Format: | Thesis |
| Language: | English |
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2016
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| Online Access: | http://hdl.handle.net/10356/68872 |