Copper nanowires bonding for three dimensional interconnections

Over the past few decades, the semiconductor industry has been advancing by increasing transistor density on a microchip through continuous device scaling based on the technology roadmap driven by Moore’s Law. However, new physical phenomena at scaled dimensions and fundamental limitations in materi...

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Bibliografske podrobnosti
Glavni avtor: Chun, Shu Rong
Drugi avtorji: Gan Chee Lip
Format: Thesis
Jezik:English
Izdano: 2016
Teme:
Online dostop:https://hdl.handle.net/10356/69104