Copper nanowires bonding for three dimensional interconnections
Over the past few decades, the semiconductor industry has been advancing by increasing transistor density on a microchip through continuous device scaling based on the technology roadmap driven by Moore’s Law. However, new physical phenomena at scaled dimensions and fundamental limitations in materi...
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| Format: | Thesis |
| Jezik: | English |
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2016
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| Online dostop: | https://hdl.handle.net/10356/69104 |