Copper nanowires bonding for three dimensional interconnections

Over the past few decades, the semiconductor industry has been advancing by increasing transistor density on a microchip through continuous device scaling based on the technology roadmap driven by Moore’s Law. However, new physical phenomena at scaled dimensions and fundamental limitations in materi...

Full description

Bibliographic Details
Main Author: Chun, Shu Rong
Other Authors: Gan Chee Lip
Format: Thesis
Language:English
Published: 2016
Subjects:
Online Access:https://hdl.handle.net/10356/69104