Application of fast laser deprocessing techniques in the field of semiconductor manufacturing
With technology scaling of semiconductor devices and further growth of the integrated circuit (IC) design and function complexity, it is necessary to increase the number of transistors in IC chip, layer stack, and process steps. The last few metal layers of Back End Of Line (BEOL) are usually very t...
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| Format: | Final Year Project (FYP) |
| Jezik: | English |
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2016
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| Online dostop: | http://hdl.handle.net/10356/69302 |