Failure analysis and characterization for microelectronic packaging
In the recent years, the mechanical robustness and reliability of three-dimensional (3D) integrated circuit (IC) packaging have become tremendously challenging due to its continuous reduction in size and increase in vertical integration. Thermal problems such as the silicon (Si) substrate cracking a...
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| Format: | Thesis |
| Language: | English |
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2017
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| Online Access: | http://hdl.handle.net/10356/70126 |