Non-destructive analysis of microelectronic packages using computer x-ray tomography
Explores the capabities of using the 3D CT X-ray machine in evaluating multilayered stcked modules. Positioning of samples in machine was studied. Integrated images were used to compare with the micro cross section. Variation of various parameters such as voltage and current was done.
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| Format: | Research Report |
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2008
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| Online Access: | http://hdl.handle.net/10356/7015 |