Mechanical and thermal characterization of flexible composite substrate
Woven glass/epoxy composite substrate is broadly used in the electronic industries due to its high strength to weight ratio and improved lateral properties as compared to laminated composites. The mechanical reliability of the woven epoxy glass composite substrate plays a crucial role in electronic...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2017
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| Online Access: | http://hdl.handle.net/10356/70356 |