Thermal packaging for advanced timing device in space
The Chip Scale Atomic Clock (CSAC) would allow small and portable electrical devices to have their own accurate timing device. However, the stability of CSAC has to be evaluated for various conditions and in this case, the area of application of interest is for space applications. The aim of this...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2017
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| Online Access: | http://hdl.handle.net/10356/70880 |