Scaled up Ni electroforming process for defect-free metal filling in micro trench pattern and high deposition rate

The effects of PEG & electric potential on the electroforming rate of nickel are investigated to provide for an optimum setup that can be used to support the goals of this project. The goals of this project are to ensure a bottom-up deposition of Nickel on the substrate samples as well as an imp...

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Bibliographic Details
Main Author: Sim, Nicholas Wei Qiang
Other Authors: Amitabha Das
Format: Final Year Project (FYP)
Language:English
Published: 2017
Subjects:
Online Access:http://hdl.handle.net/10356/71685