Design of wire bond inductors and high-speed printed circuit board
Wire bond technology is a matured and dominant interconnect methodology compared to other chip interconnect methodologies. The parasitic components of the bond wire, especially in high speed operating conditions, have to be modeled accurately before utilizing the bond wire in such designs. Our rese...
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| Format: | Thesis |
| Language: | English |
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2017
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| Online Access: | http://hdl.handle.net/10356/72585 |