Mechanical characterization and analysis of thin-film stacked structures for microelectronic assembly

Mechanical characterization and analysis of thin-film stacked structures for microelectronic assembly

The trend towards cost reduction, improved reliability, and increased functionality and performance in the power electronic product leads to a continuous implementation of new designs, materials, processes, and evaluation methodologies for chip- and package-level interconnections. Due to such trend,...

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Bibliographic Details
Main Author: Yeo, Swain Hong
Other Authors: Zhou Kun
Format: Thesis
Language:English
Published: 2017
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
DRNTU::Engineering::Materials::Material testing and characterization
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Online Access:http://hdl.handle.net/10356/72665

Internet

http://hdl.handle.net/10356/72665

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