Formulation and characterization of micro/nano Cu paste for electronics bonding
Three-dimensional integrated circuits (3D-IC) technology was introduced to solve the interconnect delay and huge power dissipation problems found in two-dimensional integrated circuits (2D-IC). Copper is a popular material that is used for 3D-IC interconnection applications. Metallic pastes are used...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2018
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| Online Access: | http://hdl.handle.net/10356/74020 |