Advanced flip chip and wafer level packages for 2.5D and 3D IC package technology

Advanced flip chip and wafer level packages for 2.5D and 3D IC package technology

The demand of electronic product explodes in recent years, and the trend of electronic product is portable, multifunctional and budget currently. The fan-out wafer level packaging technology is a kind of wafer level packaging technology, and it becomes more and more attractive and popular because of...

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Bibliographic Details
Main Author: Xu, Cheng
Other Authors: Zhong Zhaowei
Format: Thesis
Language:English
Published: 2018
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
DRNTU::Engineering::Materials::Mechanical strength of materials
Online Access:http://hdl.handle.net/10356/75893

Internet

http://hdl.handle.net/10356/75893

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