Advanced flip chip and wafer level packages for 2.5D and 3D IC package technology
The demand of electronic product explodes in recent years, and the trend of electronic product is portable, multifunctional and budget currently. The fan-out wafer level packaging technology is a kind of wafer level packaging technology, and it becomes more and more attractive and popular because of...
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| Format: | Thesis |
| Language: | English |
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2018
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| Online Access: | http://hdl.handle.net/10356/75893 |