Mechanical characterizations of high temperature polymer encapsulation
The development of a new high temperature polymer is the key to achieving high reliability operations in aerospace and well-logging applications as conventional encapsulation materials such as epoxy, polyimide or silicone do not suffice in high pressure high temperature (HPHT) environment. In...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2018
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| Online Access: | http://hdl.handle.net/10356/75915 |