Optimization of thermal imaging techniques in failure analysis
Lock-in thermography (LIT) has been gaining more attention from the research community for non-destructive evaluation of integrated circuits (IC) and localization of thermal active electrical defects in microelectronics and circuit reliability research. Thermal imaging is considered to be the standa...
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| Format: | Thesis |
| Language: | English |
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2019
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| Online Access: | http://hdl.handle.net/10356/76873 |