Analysis of a manufacturing system to improve performance using characteristics curve and modeling & simulation
This project aimed to present an analysis for a semiconductor assembly and test manufacturing system. The objective of the final year report was to suggest improvements to enhance the performance of the factory for the NMPCC package. This was done by studying the characteristic curves for the manufa...
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| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2019
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| Online Access: | http://hdl.handle.net/10356/77723 |