Carbon nanotube bumps for the flip chip packaging system

Carbon nanotube bumps for the flip chip packaging system

Carbon nanotube [CNT] interconnection bump joining methodology has been successfully demonstrated using flip chip test structures with bump pitches smaller than 150 μm. In this study, plasma-enhanced chemical vapor deposition approach is used to grow the CNT bumps onto the Au metallization lines. Th...

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Bibliographic Details
Main Authors: Yap, Chin Chong, Brun, Christophe, Tan, Dunlin, Li, Hong, Teo, Edwin Hang Tong, Baillargeat, Dominique, Tay, Beng Kang
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2013
Online Access:https://hdl.handle.net/10356/79979
http://hdl.handle.net/10220/9191

Internet

https://hdl.handle.net/10356/79979
http://hdl.handle.net/10220/9191

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