Report on industrial attachment with Micron Semiconductor Asia Pte Ltd

This report investigated substrate performance of different design and material for microelectronics packaging.

Bibliographic Details
Main Author:	Ng, Yew Hong.
Other Authors:	School of Mechanical and Production Engineering
Format:	Industrial Attachment (IA)
Published:	2008
Subjects:	DRNTU::Engineering::Materials
Online Access:	http://hdl.handle.net/10356/8050

Internet

http://hdl.handle.net/10356/8050