Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications

Integration of photonic devices on silicon (Si) substrates is a key method in enabling large scale manufacturing of Si-based photonic–electronic circuits for next generation systems with high performance, small form factor, low power consumption, and low cost. Germanium (Ge) is a promising material...

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Main Authors: Lee, Kwang Hong, Bao, Shuyu, Lin, Yiding, Wang, Yue, Li, Wei, Zhang, Lin, Michel, Jurgen, Fitzgerald, Eugene A., Tan, Chuan Seng, Anantha, P.
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2019
Subjects:
Online Access:https://hdl.handle.net/10356/81289
http://hdl.handle.net/10220/47457
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author Lee, Kwang Hong
Bao, Shuyu
Lin, Yiding
Wang, Yue
Li, Wei
Zhang, Lin
Michel, Jurgen
Fitzgerald, Eugene A.
Tan, Chuan Seng
Anantha, P.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Lee, Kwang Hong
Bao, Shuyu
Lin, Yiding
Wang, Yue
Li, Wei
Zhang, Lin
Michel, Jurgen
Fitzgerald, Eugene A.
Tan, Chuan Seng
Anantha, P.
author_sort Lee, Kwang Hong
collection NTU
description Integration of photonic devices on silicon (Si) substrates is a key method in enabling large scale manufacturing of Si-based photonic–electronic circuits for next generation systems with high performance, small form factor, low power consumption, and low cost. Germanium (Ge) is a promising material due to its pseudo-direct bandgap and its compatibility with Si-CMOS processing. In this article, we present our recent progress on achieving high quality germanium-on-silicon (Ge/Si) materials. Subsequently, the performance of various functional devices such as photodetectors, lasers, waveguides, and sensors that are fabricated on the Ge/Si platform are discussed. Some possible future works such as the incorporation of tin (Sn) into Ge will be proposed. Finally, some applications based on a fully monolithic integrated photonic–electronic chip on an Si platform will be highlighted at the end of this article.
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spelling ntu-10356/812892020-03-07T13:57:22Z Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications Lee, Kwang Hong Bao, Shuyu Lin, Yiding Wang, Yue Li, Wei Zhang, Lin Michel, Jurgen Fitzgerald, Eugene A. Tan, Chuan Seng Anantha, P. School of Electrical and Electronic Engineering Singapore-MIT Alliance Programme Germanium Silicon DRNTU::Engineering::Electrical and electronic engineering Integration of photonic devices on silicon (Si) substrates is a key method in enabling large scale manufacturing of Si-based photonic–electronic circuits for next generation systems with high performance, small form factor, low power consumption, and low cost. Germanium (Ge) is a promising material due to its pseudo-direct bandgap and its compatibility with Si-CMOS processing. In this article, we present our recent progress on achieving high quality germanium-on-silicon (Ge/Si) materials. Subsequently, the performance of various functional devices such as photodetectors, lasers, waveguides, and sensors that are fabricated on the Ge/Si platform are discussed. Some possible future works such as the incorporation of tin (Sn) into Ge will be proposed. Finally, some applications based on a fully monolithic integrated photonic–electronic chip on an Si platform will be highlighted at the end of this article. NRF (Natl Research Foundation, S’pore) Published version 2019-01-14T05:26:12Z 2019-12-06T14:27:31Z 2019-01-14T05:26:12Z 2019-12-06T14:27:31Z 2017 Journal Article Lee, K. H., Bao, S., Lin, Y., Li, W., Anantha, P., Zhang, L., . . . Tan, C. S. (2017). Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications. Journal of Materials Research, 32(21), 4025-4040. doi:10.1557/jmr.2017.324 0884-2914 https://hdl.handle.net/10356/81289 http://hdl.handle.net/10220/47457 10.1557/jmr.2017.324 en Journal of Materials Research © 2017 Materials Research Society. All rights reserved. This paper was published in Journal of Materials Research and is made available with permission of Materials Research Society. 16 p. application/pdf
spellingShingle Germanium
Silicon
DRNTU::Engineering::Electrical and electronic engineering
Lee, Kwang Hong
Bao, Shuyu
Lin, Yiding
Wang, Yue
Li, Wei
Zhang, Lin
Michel, Jurgen
Fitzgerald, Eugene A.
Tan, Chuan Seng
Anantha, P.
Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications
title Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications
title_full Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications
title_fullStr Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications
title_full_unstemmed Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications
title_short Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications
title_sort hetero epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications
topic Germanium
Silicon
DRNTU::Engineering::Electrical and electronic engineering
url https://hdl.handle.net/10356/81289
http://hdl.handle.net/10220/47457
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