Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

The direct-die-attached cooling solution with a diamond heat spreader and hybrid Si heat sink has been developed for hotspot cooling of a GaN-on-Si device. The hybrid heat sink combines the benefits of microchannel flow and microjet impingement. In the fabricated test chip, the small hotspot is used...

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Bibliographic Details
Main Authors: Han, Yong, Lau, Boon Long, Zhang, Xiaowu, Leong, Yoke Choy, Choo, Kok Fah
Other Authors: Temasek Laboratories
Format: Journal Article
Language:English
Published: 2016
Subjects:
Electronic cooling
heat dissipation capability
high-electron mobility transistor (HEMT)
hotspot
microchannel heat sink (MCHS)
microjet impingement
Online Access:https://hdl.handle.net/10356/81472
http://hdl.handle.net/10220/40787

Internet

https://hdl.handle.net/10356/81472
http://hdl.handle.net/10220/40787

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