Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

The direct-die-attached cooling solution with a diamond heat spreader and hybrid Si heat sink has been developed for hotspot cooling of a GaN-on-Si device. The hybrid heat sink combines the benefits of microchannel flow and microjet impingement. In the fabricated test chip, the small hotspot is used...

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书目详细资料
Main Authors: Han, Yong, Lau, Boon Long, Zhang, Xiaowu, Leong, Yoke Choy, Choo, Kok Fah
其他作者: Temasek Laboratories
格式: Journal Article
语言:English
出版: 2016
主题:
在线阅读:https://hdl.handle.net/10356/81472
http://hdl.handle.net/10220/40787