Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices
The direct-die-attached cooling solution with a diamond heat spreader and hybrid Si heat sink has been developed for hotspot cooling of a GaN-on-Si device. The hybrid heat sink combines the benefits of microchannel flow and microjet impingement. In the fabricated test chip, the small hotspot is used...
| Main Authors: | , , , , |
|---|---|
| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2016
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/81472 http://hdl.handle.net/10220/40787 |