Industrial attachment with Advanced Micro Devices

The project undertaken involved development of the encapsulation materials and process for the uBGA package. Two types of uBGA packages were evaluated.

Bibliographic Details
Main Author: Chua, Pauline May Lee.
Other Authors: Widjaja, Sujanto
Format: Industrial Attachment (IA)
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/8165