Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing
Slurry plays an important role in the material removal of chemical mechanical polishing (CMP). However, the behavior of abrasive particles of the slurry in the interface between the wafer and the pad during CMP is not fully understood. In this paper, a new computational fluid dynamic (CFD) model was...
| Main Authors: | , , |
|---|---|
| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2016
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/85031 http://hdl.handle.net/10220/40943 |