Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing
Slurry plays an important role in the material removal of chemical mechanical polishing (CMP). However, the behavior of abrasive particles of the slurry in the interface between the wafer and the pad during CMP is not fully understood. In this paper, a new computational fluid dynamic (CFD) model was...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2016
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/85031 http://hdl.handle.net/10220/40943 |
| _version_ | 1811695963552612352 |
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| author | Nguyen, N. Y. Tian, Yebing Zhong, Zhao Wei |
| author2 | School of Mechanical and Aerospace Engineering |
| author_facet | School of Mechanical and Aerospace Engineering Nguyen, N. Y. Tian, Yebing Zhong, Zhao Wei |
| author_sort | Nguyen, N. Y. |
| collection | NTU |
| description | Slurry plays an important role in the material removal of chemical mechanical polishing (CMP). However, the behavior of abrasive particles of the slurry in the interface between the wafer and the pad during CMP is not fully understood. In this paper, a new computational fluid dynamic (CFD) model was developed. It was a combination of multiphase and discrete phase modeling. The abrasive particles behavior and the slurry distribution in the interface were simulated using this model. The total numbers of particles in the gap were quantified to characterize their mechanical effects under different operating parameters. The simulation results showed that when the gap thickness increased and speeds of the wafer and the pad decreased, the total number of particles in the gap increased. It also found that the particles were non-uniformly distributed below the wafer. The results have the capacity of providing a deeper insight understanding of the material removal of the CMP mechanism. |
| first_indexed | 2024-10-01T07:31:49Z |
| format | Journal Article |
| id | ntu-10356/85031 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T07:31:49Z |
| publishDate | 2016 |
| record_format | dspace |
| spelling | ntu-10356/850312020-03-07T12:47:13Z Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing Nguyen, N. Y. Tian, Yebing Zhong, Zhao Wei School of Mechanical and Aerospace Engineering A*STAR SIMTech Chemical mechanical polishing Computational fluid dynamic Slurry plays an important role in the material removal of chemical mechanical polishing (CMP). However, the behavior of abrasive particles of the slurry in the interface between the wafer and the pad during CMP is not fully understood. In this paper, a new computational fluid dynamic (CFD) model was developed. It was a combination of multiphase and discrete phase modeling. The abrasive particles behavior and the slurry distribution in the interface were simulated using this model. The total numbers of particles in the gap were quantified to characterize their mechanical effects under different operating parameters. The simulation results showed that when the gap thickness increased and speeds of the wafer and the pad decreased, the total number of particles in the gap increased. It also found that the particles were non-uniformly distributed below the wafer. The results have the capacity of providing a deeper insight understanding of the material removal of the CMP mechanism. ASTAR (Agency for Sci., Tech. and Research, S’pore) 2016-07-15T05:44:47Z 2019-12-06T15:55:55Z 2016-07-15T05:44:47Z 2019-12-06T15:55:55Z 2014 Journal Article Nguyen, N. Y., Tian, Y., & Zhong, Z. W. (2014). Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing. The International Journal of Advanced Manufacturing Technology, 75(1), 97-106. 0268-3768 https://hdl.handle.net/10356/85031 http://hdl.handle.net/10220/40943 10.1007/s00170-014-6132-9 en The International Journal of Advanced Manufacturing Technology © 2014 Springer-Verlag London. |
| spellingShingle | Chemical mechanical polishing Computational fluid dynamic Nguyen, N. Y. Tian, Yebing Zhong, Zhao Wei Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing |
| title | Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing |
| title_full | Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing |
| title_fullStr | Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing |
| title_full_unstemmed | Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing |
| title_short | Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing |
| title_sort | modeling and simulation for the distribution of slurry particles in chemical mechanical polishing |
| topic | Chemical mechanical polishing Computational fluid dynamic |
| url | https://hdl.handle.net/10356/85031 http://hdl.handle.net/10220/40943 |
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