Palladium-coated and bare copper wire study for ultra-fine pitch wire bonding

There is growing interest in copper (Cu) wire bonding due to its significant cost savings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to develop alternative materials. Recently, palladium-coated copper (PdCu) wire has become widely u...

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Bibliographic Details
Main Authors: Lim, A. B. Y., Chang, A. C. K., Lee, C. X., Yauw, O., Chylak, B., Chen, Z.
Other Authors: School of Materials Science & Engineering
Format: Journal Article
Language:English
Published: 2013
Online Access:https://hdl.handle.net/10356/85269
http://hdl.handle.net/10220/10206