Electrical and thermal models of CNT TSV and graphite interface

Electrical and thermal models of CNT TSV and graphite interface

Carbon nanotubes (CNTs) are a suitable replacement for metals commonly used as a fill material for through substrate vias (TSVs). The electrical and thermal contact resistance, however, between the CNT TSVs and the horizontal metal interconnects (typically copper) can limit the use of CNT technology...

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Bibliographic Details
Main Authors: Vaisband, Boris, Maurice, Ange, Tan, Chong Wei, Tay, Beng Kang, Friedman, Eby G.
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2019
Subjects:
DRNTU::Engineering::Electrical and electronic engineering
Carbon Nanotubes
3-D IC
Online Access:https://hdl.handle.net/10356/90234
http://hdl.handle.net/10220/48534

Internet

https://hdl.handle.net/10356/90234
http://hdl.handle.net/10220/48534

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