Electrical and thermal models of CNT TSV and graphite interface
Carbon nanotubes (CNTs) are a suitable replacement for metals commonly used as a fill material for through substrate vias (TSVs). The electrical and thermal contact resistance, however, between the CNT TSVs and the horizontal metal interconnects (typically copper) can limit the use of CNT technology...
| Main Authors: | , , , , |
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| Format: | Journal Article |
| Language: | English |
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2019
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| Online Access: | https://hdl.handle.net/10356/90234 http://hdl.handle.net/10220/48534 |
| _version_ | 1826116160032079872 |
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| author | Vaisband, Boris Maurice, Ange Tan, Chong Wei Tay, Beng Kang Friedman, Eby G. |
| author2 | School of Electrical and Electronic Engineering |
| author_facet | School of Electrical and Electronic Engineering Vaisband, Boris Maurice, Ange Tan, Chong Wei Tay, Beng Kang Friedman, Eby G. |
| author_sort | Vaisband, Boris |
| collection | NTU |
| description | Carbon nanotubes (CNTs) are a suitable replacement for metals commonly used as a fill material for through substrate vias (TSVs). The electrical and thermal contact resistance, however, between the CNT TSVs and the horizontal metal interconnects (typically copper) can limit the use of CNT technology. A replacement for the horizontal metal interconnects in the form of graphite material is proposed in this paper. Electrical and thermal models of the interface between CNT TSVs and graphite interconnect are compared to the interface between CNT TSVs and copper interconnect. The proposed models include electrical and thermal crowding effects as well as the skin effect. The CNT/graphite interface exhibits up to 72.6% and 71.9%, respectively, lower electrical and thermal resistance as compared to the CNT/copper interface. |
| first_indexed | 2024-10-01T04:06:47Z |
| format | Journal Article |
| id | ntu-10356/90234 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T04:06:47Z |
| publishDate | 2019 |
| record_format | dspace |
| spelling | ntu-10356/902342020-03-07T14:02:39Z Electrical and thermal models of CNT TSV and graphite interface Vaisband, Boris Maurice, Ange Tan, Chong Wei Tay, Beng Kang Friedman, Eby G. School of Electrical and Electronic Engineering Nanoelectronics Center of Excellence DRNTU::Engineering::Electrical and electronic engineering Carbon Nanotubes 3-D IC Carbon nanotubes (CNTs) are a suitable replacement for metals commonly used as a fill material for through substrate vias (TSVs). The electrical and thermal contact resistance, however, between the CNT TSVs and the horizontal metal interconnects (typically copper) can limit the use of CNT technology. A replacement for the horizontal metal interconnects in the form of graphite material is proposed in this paper. Electrical and thermal models of the interface between CNT TSVs and graphite interconnect are compared to the interface between CNT TSVs and copper interconnect. The proposed models include electrical and thermal crowding effects as well as the skin effect. The CNT/graphite interface exhibits up to 72.6% and 71.9%, respectively, lower electrical and thermal resistance as compared to the CNT/copper interface. MOE (Min. of Education, S’pore) Accepted version 2019-06-04T06:52:30Z 2019-12-06T17:43:42Z 2019-06-04T06:52:30Z 2019-12-06T17:43:42Z 2018 Journal Article Vaisband, B., Maurice, A., Tan, C. W., Tay, B. K., & Friedman, E. G. (2018). Electrical and thermal models of CNT TSV and graphite interface. IEEE Transactions on Electron Devices, 65(5), 1880-1886. doi:10.1109/TED.2018.2812761 0018-9383 https://hdl.handle.net/10356/90234 http://hdl.handle.net/10220/48534 10.1109/TED.2018.2812761 en IEEE Transactions on Electron Devices © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/TED.2018.2812761 6 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering Carbon Nanotubes 3-D IC Vaisband, Boris Maurice, Ange Tan, Chong Wei Tay, Beng Kang Friedman, Eby G. Electrical and thermal models of CNT TSV and graphite interface |
| title | Electrical and thermal models of CNT TSV and graphite interface |
| title_full | Electrical and thermal models of CNT TSV and graphite interface |
| title_fullStr | Electrical and thermal models of CNT TSV and graphite interface |
| title_full_unstemmed | Electrical and thermal models of CNT TSV and graphite interface |
| title_short | Electrical and thermal models of CNT TSV and graphite interface |
| title_sort | electrical and thermal models of cnt tsv and graphite interface |
| topic | DRNTU::Engineering::Electrical and electronic engineering Carbon Nanotubes 3-D IC |
| url | https://hdl.handle.net/10356/90234 http://hdl.handle.net/10220/48534 |
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