Electrical and thermal models of CNT TSV and graphite interface
Carbon nanotubes (CNTs) are a suitable replacement for metals commonly used as a fill material for through substrate vias (TSVs). The electrical and thermal contact resistance, however, between the CNT TSVs and the horizontal metal interconnects (typically copper) can limit the use of CNT technology...
| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2019
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/90234 http://hdl.handle.net/10220/48534 |