Statistical modeling of via redundancy effects on interconnect reliability
Electromigration is an important failure mechanism in the nano-interconnects of modern IC technology. Various approaches have been investigated to prolong the lifetime of an interconnect. One such approach i...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/90793 http://hdl.handle.net/10220/6345 |