Fracture toughness assessment of a solder joint using double cantilever beam specimens

Fracture toughness assessment of a solder joint using double cantilever beam specimens

Conventional assessment of solder joint reliability uses either ball shear test or solder ball pull test. The test results are reported in terms of materials strength in either shear or tensile mode, and the strength values are size-dependent. Therefore these test results are largely useful only for...

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Bibliographic Details
Main Authors: Lee, Adeline Puay Chen, Lim, Zan Xuan, Yantara, Natalia, Loo, Shane Zhi Yuan, Tee, Tong Yan, Tan, Cher Ming, Chen, Zhong
Other Authors: School of Electrical and Electronic Engineering
Format: Conference Paper
Language:English
Published: 2010
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
DRNTU::Engineering::Materials
Online Access:https://hdl.handle.net/10356/91518
http://hdl.handle.net/10220/6384

Internet

https://hdl.handle.net/10356/91518
http://hdl.handle.net/10220/6384

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