Effect of processing parameters on electroless Cu seed layer properties

Effect of processing parameters on electroless Cu seed layer properties

Electroless Cu seed layer is essential for subsequent copper metallization by electroplating for sub-micron wafer technology. This layer is required to provide good step coverage and high uniformity. In the current work, electroless copper was deposited on a TiN surface activated by palladium. The e...

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Bibliographic Details
Main Authors: Chen, Z., Chan, L., See, Alex K. H., Law, S. B., Zeng, K. Y., Shen, L., Tee, K. C., Ee, Elden Yong Chiang
Other Authors: School of Materials Science & Engineering
Format: Journal Article
Language:English
Published: 2012
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Online Access:https://hdl.handle.net/10356/94035
http://hdl.handle.net/10220/8212

Internet

https://hdl.handle.net/10356/94035
http://hdl.handle.net/10220/8212

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