Materials and electrical characterization of Er(Si1-xGex)(2-y) films formed on Si1-xGex(001) (x=0-0.3) via rapid thermal annealing
We studied erbium germanosilicide films formed on relaxed p-type Si1−xGex(100) (x = 0–0.3) virtual substrates by conventional rapid thermal annealing (RTA) at temperatures of 500–700°C. Two dimensional X-ray diffraction and pole figure measurements revealed that the silicide films formed were epitax...
Main Authors: | Setiawan, Y., Tan, Eu Jin, Pey, Kin Leong, Chi, Dong Zhi, Lee, Pooi See, Hoe, Keat Mun |
---|---|
Other Authors: | School of Materials Science & Engineering |
Format: | Journal Article |
Language: | English |
Published: |
2012
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/94039 http://hdl.handle.net/10220/8006 |
Similar Items
-
Interfacial reacions of Ni on Si1-xGex (x=0.2, 0.3) at low temperature by rapid thermal annealing
by: Pey, Kin Leong, et al.
Published: (2012) -
Textured Ni(Pt) germanosilicide formation on a condensed Si1-xGex/Si substrate
by: Setiawan, Y., et al.
Published: (2012) -
The interfacial reaction of Ni on (100) Si₁âxGex (x=0, 0.25) and (111) Ge
by: Jin, Lijuan, et al.
Published: (2003) -
Effects of Ti/Co and Co/Ti systems on the germanosilicidation of poly-Si capped poly-Si1−xGex substrate
by: Li, Y. S., et al.
Published: (2013) -
Poly-Si₁âxGex Film Growth for Ni Germanosilicided Metal Gate
by: Yu, Hongpeng, et al.
Published: (2004)