Fracture toughness measurement of thin films on compliant substrate using controlled buckling test
Thin films and multilayered structures are increasingly used in the industry. One of the important mechanical properties of these thin layers is the fracture toughness, which may be quite different from the known value of the bulk sample due to microstructural difference. In the design towards devic...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2012
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| Online Access: | https://hdl.handle.net/10356/94153 http://hdl.handle.net/10220/8202 |
| _version_ | 1826127216282435584 |
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| author | Chen, Zhong Gan, Zhenghao |
| author2 | School of Materials Science & Engineering |
| author_facet | School of Materials Science & Engineering Chen, Zhong Gan, Zhenghao |
| author_sort | Chen, Zhong |
| collection | NTU |
| description | Thin films and multilayered structures are increasingly used in the industry. One of the important mechanical properties of these thin layers is the fracture toughness, which may be quite different from the known value of the bulk sample due to microstructural difference. In the design towards device flexibility and scratch resistance, for example, fracture toughness is an important parameter of consideration. This work presents a testing scheme using controlled buckling experiment to determine the fracture toughness of brittle thin films prepared on compliant substrates. When the film is under tension, steady-state channelling cracks form in parallel to each other. Critical fracture strain can be calculated by the measuring the displacement of the buckled plate. The fracture toughness can then be obtained with the help of finite element calculation. When the substrate experiences plastic deformation, the energy release rate is increased by the degree of plasticity. Fracture toughness measurement of two types of thin film Cu–Sn intermetallic compounds has been given to illustrate the merits of such a test scheme. |
| first_indexed | 2024-10-01T07:05:10Z |
| format | Journal Article |
| id | ntu-10356/94153 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T07:05:10Z |
| publishDate | 2012 |
| record_format | dspace |
| spelling | ntu-10356/941532023-07-14T15:53:35Z Fracture toughness measurement of thin films on compliant substrate using controlled buckling test Chen, Zhong Gan, Zhenghao School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films Thin films and multilayered structures are increasingly used in the industry. One of the important mechanical properties of these thin layers is the fracture toughness, which may be quite different from the known value of the bulk sample due to microstructural difference. In the design towards device flexibility and scratch resistance, for example, fracture toughness is an important parameter of consideration. This work presents a testing scheme using controlled buckling experiment to determine the fracture toughness of brittle thin films prepared on compliant substrates. When the film is under tension, steady-state channelling cracks form in parallel to each other. Critical fracture strain can be calculated by the measuring the displacement of the buckled plate. The fracture toughness can then be obtained with the help of finite element calculation. When the substrate experiences plastic deformation, the energy release rate is increased by the degree of plasticity. Fracture toughness measurement of two types of thin film Cu–Sn intermetallic compounds has been given to illustrate the merits of such a test scheme. Accepted version 2012-06-19T02:45:49Z 2019-12-06T18:51:39Z 2012-06-19T02:45:49Z 2019-12-06T18:51:39Z 2007 2007 Journal Article Chen, Z., & Gan, Z. (2007). Fracture Toughness Measurement of Thin Films on Compliant Substrate Using Controlled Buckling Test. Thin Solid Films, 515(6), 3305–3309. https://hdl.handle.net/10356/94153 http://hdl.handle.net/10220/8202 10.1016/j.tsf.2006.01.044 en Thin solid films © 2006 Elsevier. This is the author created version of a work that has been peer reviewed and accepted for publication by Thin Solid Films, Elsevier. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.tsf.2006.01.044]. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films Chen, Zhong Gan, Zhenghao Fracture toughness measurement of thin films on compliant substrate using controlled buckling test |
| title | Fracture toughness measurement of thin films on compliant substrate using controlled buckling test |
| title_full | Fracture toughness measurement of thin films on compliant substrate using controlled buckling test |
| title_fullStr | Fracture toughness measurement of thin films on compliant substrate using controlled buckling test |
| title_full_unstemmed | Fracture toughness measurement of thin films on compliant substrate using controlled buckling test |
| title_short | Fracture toughness measurement of thin films on compliant substrate using controlled buckling test |
| title_sort | fracture toughness measurement of thin films on compliant substrate using controlled buckling test |
| topic | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films |
| url | https://hdl.handle.net/10356/94153 http://hdl.handle.net/10220/8202 |
| work_keys_str_mv | AT chenzhong fracturetoughnessmeasurementofthinfilmsoncompliantsubstrateusingcontrolledbucklingtest AT ganzhenghao fracturetoughnessmeasurementofthinfilmsoncompliantsubstrateusingcontrolledbucklingtest |