The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects

The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects

In this study, numerical work using ANSYS and analytical work based on Eshelby models were performed to examine the effect of aspect ratio scaling on the hydrostatic stress in passivated metal interconnects. Aluminium and copper interconnects passivated with phosphosilicate glass (PSG) with aspect r...

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Bibliographic Details
Main Authors: Ang, Derrick, Wong, Chee C., Ramanujan, Raju V.
Other Authors: School of Materials Science & Engineering
Format: Journal Article
Language:English
Published: 2011
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:https://hdl.handle.net/10356/94246
http://hdl.handle.net/10220/7256

Internet

https://hdl.handle.net/10356/94246
http://hdl.handle.net/10220/7256

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