Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction

Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction

Ni and its alloys possess a lower reaction rate with Sn than Cu and Cu alloys. Ni-based under bump metallization (UBM) therefore receives considerable attention from the microelectronic packaging industry for the popular flipchip applications. In this work, we study the interfacial reaction of elect...

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Bibliographic Details
Main Authors: He, Min, Lau, Wee Hua, Qi, Guojun, Chen, Zhong
Other Authors: School of Materials Science & Engineering
Format: Journal Article
Language:English
Published: 2012
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Online Access:https://hdl.handle.net/10356/94359
http://hdl.handle.net/10220/8208

Internet

https://hdl.handle.net/10356/94359
http://hdl.handle.net/10220/8208

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