Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction
Ni and its alloys possess a lower reaction rate with Sn than Cu and Cu alloys. Ni-based under bump metallization (UBM) therefore receives considerable attention from the microelectronic packaging industry for the popular flipchip applications. In this work, we study the interfacial reaction of elect...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/94359 http://hdl.handle.net/10220/8208 |