Fracture toughness of Cu-Sn intermetallic thin films

Fracture toughness of Cu-Sn intermetallic thin films

Intermetallic compounds (IMCs) are formed as a result of interaction between solder and metallization to form joints in electronic packaging. These joints provide mechanical and electrical contacts between components. The knowledge of fracture strength of the IMCs will facilitate predicting the over...

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Bibliographic Details
Main Authors: Li, M., Chen, Z., Balakrisnan, Bavani, Chum, Chan Choy, Cahyadi, Tommy
Other Authors: School of Materials Science & Engineering
Format: Journal Article
Language:English
Published: 2012
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Online Access:https://hdl.handle.net/10356/95014
http://hdl.handle.net/10220/8207

Internet

https://hdl.handle.net/10356/95014
http://hdl.handle.net/10220/8207

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