Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test

Adhesion between barrier layers and interconnect metals or dielectrics continues to be a significant concern in the microelectronic industry, with delamination occurring in between the layers leading to device failure. As the sizes of transistors are scaled down to submicron regime, new materials an...

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书目详细资料
Main Authors: Prasad, K., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Chen, Zhong, Zhang, Sam, Chen, Zhe
其他作者: School of Materials Science & Engineering
格式: Journal Article
语言:English
出版: 2012
主题:
在线阅读:https://hdl.handle.net/10356/95351
http://hdl.handle.net/10220/8218