Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test
Adhesion between barrier layers and interconnect metals or dielectrics continues to be a significant concern in the microelectronic industry, with delamination occurring in between the layers leading to device failure. As the sizes of transistors are scaled down to submicron regime, new materials an...
| Main Authors: | , , , , , |
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| 其他作者: | |
| 格式: | Journal Article |
| 语言: | English |
| 出版: |
2012
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| 主题: | |
| 在线阅读: | https://hdl.handle.net/10356/95351 http://hdl.handle.net/10220/8218 |