Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test

Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test

Adhesion between barrier layers and interconnect metals or dielectrics continues to be a significant concern in the microelectronic industry, with delamination occurring in between the layers leading to device failure. As the sizes of transistors are scaled down to submicron regime, new materials an...

Full description

Bibliographic Details
Main Authors: Prasad, K., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Chen, Zhong, Zhang, Sam, Chen, Zhe
Other Authors: School of Materials Science & Engineering
Format: Journal Article
Language:English
Published: 2012
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Online Access:https://hdl.handle.net/10356/95351
http://hdl.handle.net/10220/8218

Internet

https://hdl.handle.net/10356/95351
http://hdl.handle.net/10220/8218

Similar Items