Buckling and cracking of thin films on compliant substrates under compression
It is shown that unless the substrate is at least as stiff as the film, the energy stored in the substrate contributes significantly to the energy release rate of film delamination under compression either with or without cracking. For very compliant substrates, such as polyethylene terephthalate (P...
| Main Authors: | , |
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| Outros Autores: | |
| Formato: | Journal Article |
| Idioma: | English |
| Publicado em: |
2012
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| Acesso em linha: | https://hdl.handle.net/10356/95456 http://hdl.handle.net/10220/8214 |