Buckling and cracking of thin films on compliant substrates under compression

It is shown that unless the substrate is at least as stiff as the film, the energy stored in the substrate contributes significantly to the energy release rate of film delamination under compression either with or without cracking. For very compliant substrates, such as polyethylene terephthalate (P...

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Detalhes bibliográficos
Principais autores: Cotterell, Brian, Chen, Zhong
Outros Autores: School of Materials Science & Engineering
Formato: Journal Article
Idioma:English
Publicado em: 2012
Assuntos:
Acesso em linha:https://hdl.handle.net/10356/95456
http://hdl.handle.net/10220/8214