A nanoelectromechanical-switch-based thermal management for 3-D integrated many-core memory-processor system
Tera-scale has become the recent interest for high-performance computing system. In order to increase bandwidth yet decrease power, 3-D integrated many-core memory-processor system is one of the most promising solutions. However, the increased power density and longer vertical heat-removal path in 3...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/95634 http://hdl.handle.net/10220/8749 |