Thermal-mechanical design of sandwich SiC power module with micro-channel cooling
A sandwich packaging structure of SiC power module for HEV application has been designed and numerically investigated by CFD study. The design has a micro-channel heat sink integrated in the back Cu-layer of DBC substrate. Doubleside cooling is adopted and liquid coolant (ethylene glycol, 105 °C) fl...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/96479 http://hdl.handle.net/10220/17272 |