Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits
An analytical model is proposed which relates the bonding temperature, pressure and duration with the integrity of metal–metal thermocompression bonds. Unlike previous models, this approach takes into account the pressure-dependent time evolution of the thermocompression bond formation. The model al...
| Main Authors: | , , , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2013
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| Online Access: | https://hdl.handle.net/10356/96629 http://hdl.handle.net/10220/10368 |