Effects of Ti/Co and Co/Ti systems on the germanosilicidation of poly-Si capped poly-Si1−xGex substrate

Ti/Co and Co/Ti bilayered systems were used for the formation of Co germanosilicide on polysilicon buffered poly-Si1−xGex (x=0.2, 0.3) gate stacks. In both cases, substantial Ge was found to segregate to the grain boundaries at the surface of the polycrystalline silicide (i.e., CoSiGe) films, result...

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Main Authors: Li, Y. S., Lee, Pooi See, Pey, Kin Leong
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2013
Subjects:
Online Access:https://hdl.handle.net/10356/97519
http://hdl.handle.net/10220/10503
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author Li, Y. S.
Lee, Pooi See
Pey, Kin Leong
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Li, Y. S.
Lee, Pooi See
Pey, Kin Leong
author_sort Li, Y. S.
collection NTU
description Ti/Co and Co/Ti bilayered systems were used for the formation of Co germanosilicide on polysilicon buffered poly-Si1−xGex (x=0.2, 0.3) gate stacks. In both cases, substantial Ge was found to segregate to the grain boundaries at the surface of the polycrystalline silicide (i.e., CoSiGe) films, resulting in a substantial degradation in the sheet resistance and a poor quality of the silicide films. It is shown that Ge is probably being expelled from the poly-SiGe grain and segregates to the grain boundaries during the annealing process, leading to the undesirable sheet resistance and poor film morphology observed from the Co germanosilicide films.
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spelling ntu-10356/975192020-06-01T10:01:54Z Effects of Ti/Co and Co/Ti systems on the germanosilicidation of poly-Si capped poly-Si1−xGex substrate Li, Y. S. Lee, Pooi See Pey, Kin Leong School of Electrical and Electronic Engineering School of Materials Science & Engineering Singapore-MIT Alliance Programme Microelectronics Centre DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films Ti/Co and Co/Ti bilayered systems were used for the formation of Co germanosilicide on polysilicon buffered poly-Si1−xGex (x=0.2, 0.3) gate stacks. In both cases, substantial Ge was found to segregate to the grain boundaries at the surface of the polycrystalline silicide (i.e., CoSiGe) films, resulting in a substantial degradation in the sheet resistance and a poor quality of the silicide films. It is shown that Ge is probably being expelled from the poly-SiGe grain and segregates to the grain boundaries during the annealing process, leading to the undesirable sheet resistance and poor film morphology observed from the Co germanosilicide films. 2013-06-20T02:50:56Z 2019-12-06T19:43:31Z 2013-06-20T02:50:56Z 2019-12-06T19:43:31Z 2004 2004 Journal Article Li, Y. S., Lee, P. S., & Pey, K. L. (2004). Effects of Ti/Co and Co/Ti systems on the germanosilicidation of poly-Si capped poly-Si1−xGex substrate. Thin Solid Films, 462-463, 209-212. 0040-6090 https://hdl.handle.net/10356/97519 http://hdl.handle.net/10220/10503 10.1016/j.tsf.2004.05.025 en Thin solid films © 2004 Elsevier B.V.
spellingShingle DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Li, Y. S.
Lee, Pooi See
Pey, Kin Leong
Effects of Ti/Co and Co/Ti systems on the germanosilicidation of poly-Si capped poly-Si1−xGex substrate
title Effects of Ti/Co and Co/Ti systems on the germanosilicidation of poly-Si capped poly-Si1−xGex substrate
title_full Effects of Ti/Co and Co/Ti systems on the germanosilicidation of poly-Si capped poly-Si1−xGex substrate
title_fullStr Effects of Ti/Co and Co/Ti systems on the germanosilicidation of poly-Si capped poly-Si1−xGex substrate
title_full_unstemmed Effects of Ti/Co and Co/Ti systems on the germanosilicidation of poly-Si capped poly-Si1−xGex substrate
title_short Effects of Ti/Co and Co/Ti systems on the germanosilicidation of poly-Si capped poly-Si1−xGex substrate
title_sort effects of ti co and co ti systems on the germanosilicidation of poly si capped poly si1 xgex substrate
topic DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
url https://hdl.handle.net/10356/97519
http://hdl.handle.net/10220/10503
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