Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects
This paper presents a fast and accurate steady state thermal simulator for heatsink and microfluid-cooled 3D-ICs. This model considers the thermal effect of TSVs at fine-granularity by calculating the anisotropic equivalent thermal conductances of a solid grid cell if TSVs are inserted. Entrance eff...
| Main Authors: | , , , , |
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| 其他作者: | |
| 格式: | Conference Paper |
| 语言: | English |
| 出版: |
2013
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| 主题: | |
| 在线阅读: | https://hdl.handle.net/10356/98133 http://hdl.handle.net/10220/17974 |