A low normal force contact using photolithography and Ni-Co electro fine forming technology
This new technology is realized by Photo Resist Lithography and Ni-Co Electro Fine Forming technology, and enables the design of a small contact spring for applications requiring high density, high speed and high durability. The evaluation result proved the capability of Low Normal Force (0.10N-0....
| Main Authors: | , |
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| Format: | Proceeding Paper |
| Language: | English English |
| Published: |
2009
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/33437/1/A_Low_Normal_Force_Contact_using_Photolithography_and_Ni-Co_Electro_Fine_Forming_Technology.pdf http://irep.iium.edu.my/33437/2/Tech._Paper_Conf._Spring2009_20090515.pdf |
| _version_ | 1825647656511209472 |
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| author | Bhuiyan, Moinul Takemasa, Eiichiro |
| author_facet | Bhuiyan, Moinul Takemasa, Eiichiro |
| author_sort | Bhuiyan, Moinul |
| collection | IIUM |
| description | This new technology is realized by Photo Resist Lithography and Ni-Co Electro Fine Forming technology, and enables
the design of a small contact spring for applications requiring high density, high speed and high durability. The
evaluation result proved the capability of Low Normal Force (0.10N-0.15N at 0.3mm) at contact point (5μm radius),
durability of 100,000 contact cycles (less than 50m�). The particle size of the Ni-Co crystal must be less than 100nm as measured by STEM. |
| first_indexed | 2024-03-05T23:20:50Z |
| format | Proceeding Paper |
| id | oai:generic.eprints.org:33437 |
| institution | International Islamic University Malaysia |
| language | English English |
| last_indexed | 2024-03-05T23:20:50Z |
| publishDate | 2009 |
| record_format | dspace |
| spelling | oai:generic.eprints.org:334372023-05-16T07:23:02Z http://irep.iium.edu.my/33437/ A low normal force contact using photolithography and Ni-Co electro fine forming technology Bhuiyan, Moinul Takemasa, Eiichiro TA165 Engineering instruments, meters, etc. Industrial instrumentation This new technology is realized by Photo Resist Lithography and Ni-Co Electro Fine Forming technology, and enables the design of a small contact spring for applications requiring high density, high speed and high durability. The evaluation result proved the capability of Low Normal Force (0.10N-0.15N at 0.3mm) at contact point (5μm radius), durability of 100,000 contact cycles (less than 50m�). The particle size of the Ni-Co crystal must be less than 100nm as measured by STEM. 2009-05-14 Proceeding Paper PeerReviewed application/pdf en http://irep.iium.edu.my/33437/1/A_Low_Normal_Force_Contact_using_Photolithography_and_Ni-Co_Electro_Fine_Forming_Technology.pdf application/pdf en http://irep.iium.edu.my/33437/2/Tech._Paper_Conf._Spring2009_20090515.pdf Bhuiyan, Moinul and Takemasa, Eiichiro (2009) A low normal force contact using photolithography and Ni-Co electro fine forming technology. In: TE-Japan Technical Conference, 14 May 2009, Kawasaki, Japan. |
| spellingShingle | TA165 Engineering instruments, meters, etc. Industrial instrumentation Bhuiyan, Moinul Takemasa, Eiichiro A low normal force contact using photolithography and Ni-Co electro fine forming technology |
| title | A low normal force contact using photolithography and Ni-Co electro fine forming technology |
| title_full | A low normal force contact using photolithography and Ni-Co electro fine forming technology |
| title_fullStr | A low normal force contact using photolithography and Ni-Co electro fine forming technology |
| title_full_unstemmed | A low normal force contact using photolithography and Ni-Co electro fine forming technology |
| title_short | A low normal force contact using photolithography and Ni-Co electro fine forming technology |
| title_sort | low normal force contact using photolithography and ni co electro fine forming technology |
| topic | TA165 Engineering instruments, meters, etc. Industrial instrumentation |
| url | http://irep.iium.edu.my/33437/1/A_Low_Normal_Force_Contact_using_Photolithography_and_Ni-Co_Electro_Fine_Forming_Technology.pdf http://irep.iium.edu.my/33437/2/Tech._Paper_Conf._Spring2009_20090515.pdf |
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