A correlative study of interfacial segregation in a Cu-doped TiNiSn thermoelectric half-Heusler alloy

The performance of thermoelectric materials depends on both their atomic-scale chemistry and the nature of microstructural details such as grain boundaries and inclusions. Here, the elemental distribution throughout a TiNiCu<sub>0.1</sub>Sn thermoelectric material has been examined in a...

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Bibliographic Details
Main Authors: Halpin, JE, Jenkins, B, Moody, MP, Webster, RWH, Bos, J-WG, Bagot, PAJ, MacLaren, DA
Format: Journal article
Language:English
Published: American Chemical Society 2022