A New Methodology For In-Situ Residual Stress Measurement In MEMS Structures
In this paper, a new approach is presented for local residual stress measurement in MEMS structures. The newly proposed approach involves incremental focused ion beam (FIB) milling of annular trenches at material surface, combined with high resolution SEM imaging and Digital Image Correlation (DIC)...
| Main Authors: | , , , , |
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| Format: | Conference item |
| Published: |
2010
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